Battery SystemCell interconnection, module-to-module connection, and high-voltage output of battery packs Solutions: Flexible Copper/Aluminum Busbars: Absorb expansion stress during charge/discharge, preventing weld joint failure caused by rigid connections. Laser Welding / Ultrasonic Welding: Applied for cell terminal-to-aluminum busbar joining, ensuring low resistance and high reliability. Powder Coating / PVC Dip Insulation: Resistant to electrolyte corrosion, suitable for high-voltage platforms (up to 800V), with thin and uniform insulation layers.
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Motor SystemThree-phase AC connection between motor controller and motor Solutions: Hybrid Rigid-Flexible Busbar Design: Rigid copper busbars for fixed ends; flexible busbars to absorb vibration and prevent weld cracking. Insert Injection Molding: Copper busbars are overmolded with engineering plastics (e.g., PA66/PPS) to ensure precise phase positioning, gap filling, and short-circuit prevention.
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Power Electronics System (Inverter / PDU)(IGBT module interconnection and high-voltage power distribution for fixed, high-current applications) Applications: Copper busbars for MCU DC-link, IGBT modules, and DC-link capacitor connections Insulated (dip-coated / powder-coated) copper busbars for PDU/BDU main circuits, fast charging, and HV distribution Extruded rigid copper busbars for battery pack main circuits and high-current module interconnections
Solutions: Insert Injection Molding: Integrates busbars into an insulated plastic frame for precise positioning and space-saving design. Brazing: Enables reliable Cu–Al transition joints, mitigating galvanic corrosion.
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